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Home>Product Center>K6T0808C2E-DB70
Warm reminder: The pictures are for reference only, and the goods are subject to the physical objects.

K6T0808C2E-DB70 Sample Application

Manufacturer Samsung Semiconductor, Inc
Packaging/Specification Samsung Semiconductor, Inc.
RoHs Status: 3392
stock 3392
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Application price

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The K6T0808C2E-DB70 parts manufactured by SAMSUNG are available for purchase at Jotrin Electronics website. Here you can find a wide variety of types and values ​​of electronic parts from the world's leading manufacturers. The K6T0808C2E-DB70 components of Jotrin Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.

The production status marked on Jotrin.com is for reference only. If you did not find what you were looking for, you can get more value information by email, such as the K6T0808C2E-DB70 Inventory quantity, preferential price, and manufacturer. We are always happy to hear from you so feel free to contact us.

K6T0808C1D-TF55 with pin details manufactured by SAMSUNG. The K6T0808C1D-TF55 is available in TSOP Package, is part of the IC Chips.

K6T0808C1D-TF70 with user guide manufactured by SAMSUNG. The K6T0808C1D-TF70 is available in TSOP Package, is part of the Memory.

K6T0808C1D-TP70 with circuit diagram manufactured by SAMSUNG. The K6T0808C1D-TP70 is available in TSOP Package, is part of the IC Chips.

K6T0808C1E-DB-70 with EDA / CAD Models manufactured by SANSUMG. The K6T0808C1E-DB-70 is available in DIP Package, is part of the IC Chips.

RMB remittance information :
Corporate name: Broadic electronics company limited .
account number : None
Bank of deposit: None
   
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