MAT10050 Product Details
MACOM attenuator chips are fabricated using ourstate of the art thin film metallization and advanced photolithographytechnology. All devices are available in chip form with a metalizedground connection on the back. This ground is wrappedaround on the four corners of the chip so additionalground bonding ribbon is not required.The chips may be attached using conductive epoxy orsolder preform. Gold contacts on the input and outputpads make assembly, using standard bonding equipment,fast and reliable. Custom values and configurationavailable on request.
Feature
- RoHS
- DC to 20 GHz
- Medium Power Handling 2W CW
- Return Loss > 16 dB 13 to 20 GHz
- Return Loss > 18 dB DC to 12 GHz
- Flat Response From DC to 20 GHz
- Space Saving Footprint .030” X .030” (762 X .762mm)
- Ground Wrap to Top (No ground bonding required)
- Very Good Stability Over Temperature (TCR < 100 PPM)
Applications
- Attn.: 5 dB
