XC7K160T-3FBG676E Product Details
General Description
Xilinx 7 series FPGAs comprise four FPGA famililes that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:
· Spartan@-7 Family: Optimized for low cost, lovwest power, and high I/O performance. Available in low-cost, very small fom-factor packaging for smallest PCB footprint.
· Artixe-7 Family: Optimized for low power applications requirning serial transceivers and high DSP and logic throughput. Provides the lowest total bill of materials cost for high-throughput, cost-sensitive applications.
· Kintexe-7 Family: Oplimized for best price-performance witha 2X improvement compared to previous generation, enabling a new class of FPGAs.
· Virtex@-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect(SSI) technology.
Summary of 7 Series FPGA Features
· Advanced high-performance FPGA logic based on real 6-input look-up table(LUT) technology configurable as distributed memory.
· 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
· High-performance SelectlOTM technology with support for DDR3 interfaces up to 1,866 Mb/s.
· High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
· A user configurable analog interface(XADC), incoporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
· DSP slices with 25 ×18 multiplier,48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coeficient filtering.
· Powerful clock management tiles(CMT), combining phase-locked loop(PLL) and mixed-mode clock manager(MMCM) blocks for high precision and low jitter.
· Quickly deploy embedded processing with MicroBlazeTM processor.
· Integrated block for PCI Express?(PCle), for up to x8 Gen3 Endpoint and Root Port designs.
· Wide variety of configuration options, including support for commodity memories,256-bit AES encryption with HMAC/SHA-256
authentication, and built-in SEU detection and correction.
· Low-cost, wire-bond, bare-die flip-chip, and high signal integrnty flipchip packaging offering easy migration between family members in the same package. Alf packages available in Pb-free and selected packages in Pb option.
· Designed for high performance and lowest power with 28 nm, HKMG, HPL process,1.0V core voltage process technology and
0.9V core volitage option for even lower power.
Xilinx 7 series FPGAs comprise four FPGA famililes that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:
· Spartan@-7 Family: Optimized for low cost, lovwest power, and high I/O performance. Available in low-cost, very small fom-factor packaging for smallest PCB footprint.
· Artixe-7 Family: Optimized for low power applications requirning serial transceivers and high DSP and logic throughput. Provides the lowest total bill of materials cost for high-throughput, cost-sensitive applications.
· Kintexe-7 Family: Oplimized for best price-performance witha 2X improvement compared to previous generation, enabling a new class of FPGAs.
· Virtex@-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect(SSI) technology.
Summary of 7 Series FPGA Features
· Advanced high-performance FPGA logic based on real 6-input look-up table(LUT) technology configurable as distributed memory.
· 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
· High-performance SelectlOTM technology with support for DDR3 interfaces up to 1,866 Mb/s.
· High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
· A user configurable analog interface(XADC), incoporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
· DSP slices with 25 ×18 multiplier,48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coeficient filtering.
· Powerful clock management tiles(CMT), combining phase-locked loop(PLL) and mixed-mode clock manager(MMCM) blocks for high precision and low jitter.
· Quickly deploy embedded processing with MicroBlazeTM processor.
· Integrated block for PCI Express?(PCle), for up to x8 Gen3 Endpoint and Root Port designs.
· Wide variety of configuration options, including support for commodity memories,256-bit AES encryption with HMAC/SHA-256
authentication, and built-in SEU detection and correction.
· Low-cost, wire-bond, bare-die flip-chip, and high signal integrnty flipchip packaging offering easy migration between family members in the same package. Alf packages available in Pb-free and selected packages in Pb option.
· Designed for high performance and lowest power with 28 nm, HKMG, HPL process,1.0V core voltage process technology and
0.9V core volitage option for even lower power.
Feature
- Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
- 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
- High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
- High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
- A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
- DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
- Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
- Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
- Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
- Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
- Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
